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RL-601T iPhone X-17 Middle Layer BGA Reballing Planting Tin Platform PCB Heating Platform full circuit reverse function

SKU: 10395950676

4.4
USD48.19 USD85.19

Pay in 4 interest-free payments of $12.05 Learn more

Shipping Estimate
USA
  • USA
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Ships within 48 hours · Estimated delivery Sep 18 - Sep 23

Description

full circuit reverse function

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Product features :

5mm high-quality pure copper probes

RL-601T iPhone X-17 Middle Layer BGA Reballing Planting Tin Platform PCB Heating Platform full circuit reverse functionRelife RL 601T Middle Layer Tin Planting Platform for iPhone X 17 Pro Max motherboard BGA reballing repair. RL 601T 31 In 1 BGA reballing platform with steel mesh stencil for iPhone X 11 12 13 14 15 16 17 motherboard frame tin planting reballing soldering desoldering. Relife iPhone middle layer planting tin soldering fixture. Features: 1. Middle layer tin planting platform set for iPhone X XS XS Max 11 11 Pro 11Pro Max 12 12 Mini 12 Pro 12Pro Max 13

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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