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MIJING MS1-MINI Chip Glue Removal Table Heating Platform BGA Soldering Station Product Color: White and Gray

SKU: 42816120376

4.8
USD13.09 USD33.09

Pay in 4 interest-free payments of $3.27 Learn more

Shipping Estimate
USA
  • USA
  • CAN

Ships within 48 hours · Estimated delivery Sep 11 - Sep 16

Description

Product Color: White and Gray

Please Note: The platform comes with iOS A10-A18 Pro stencil

0 version for Mobile Phone Repair (one account can be used on three computers simultaneously

online technical support and training is provided

MIJING MS1-MINI Chip Glue Removal Table Heating Platform BGA Soldering Station Product Color: White and GrayMIJING MS1 MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1 MINI glue removal desoldering station, rapid heating, one button adjustment, easy and simple operation. Features: Rapid Heating: Adjustable temperature range (160C250C) for precise control. Efficient Heat Conduction: Aluminum substrate ensures fast and even

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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