Pay in 4 interest-free payments of $3.27 Learn more
Shipping Estimate
USA
- USA
- CAN
- USA
- CAN
Ships within 48 hours · Estimated delivery Sep 11 - Sep 16
Pay in 4 interest-free payments of $3.27 Learn more
Ships within 48 hours · Estimated delivery Sep 11 - Sep 16
Product Color: White and Gray
Please Note: The platform comes with iOS A10-A18 Pro stencil
0 version for Mobile Phone Repair (one account can be used on three computers simultaneously
online technical support and training is provided
MIJING MS1-MINI Chip Glue Removal Table Heating Platform BGA Soldering Station Product Color: White and GrayMIJING MS1 MINI Chip Glue Removal Table for heating and removing glue from mobile phone CPU RAM, NAND, eMMC, SSD, WIFI, and BGA chips without using hot air gun and soldering iron. Mijing MS1 MINI glue removal desoldering station, rapid heating, one button adjustment, easy and simple operation. Features: Rapid Heating: Adjustable temperature range (160C250C) for precise control. Efficient Heat Conduction: Aluminum substrate ensures fast and even
US$ 225.00
US$ 265.00
US$ 300.00