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XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Microscope XINZHIZAO Mac CPU 4th-11th BGA

SKU: 53001648547

4.8
USD101.50 USD123.50

Pay in 4 interest-free payments of $25.38 Learn more

Shipping Estimate
USA
  • USA
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Ships within 48 hours · Estimated delivery Sep 5 - Sep 10

Description

XINZHIZAO Mac CPU 4th-11th BGA Reballing Kit Stencil Platform for Macbook Repair Magnetic Tool For Macbook 2010-Air Pro CPU BGA Soldering repair

Intelligent anti-burn chip

Bilateral Visual Adjustment: ±5

Precise craft design and global adaptation adaptive to 110/230V wide voltage range 50/60Hz 80W rated power

XZZ AR SAM Middle Layer Reballing Platform for S21/S22/S23/S24/S25 Ultra Microscope XINZHIZAO Mac CPU 4th-11th BGAXZZ AR Series SAM Motherboard Middle Layer Planting Tin Platform for Samsung S20 S26 Ultra. XINZHIZAO XZZ Samsung motherboard reballing platform with C6 magnetic base, S20 S25, S20 Plus S25+, S20 Ultra S26U positioning platform and mid layer stencil for Samsung motherboard soldering repair. Models: S20 Ultra, S21 Ultra, S22 Ultra, S23 Ultra, S24 Ultra, S25 Ultra, S26 Ultra positioning platform with mid layer stencil. S20, S21, S22, S23, S24, S25

Exchange/Return Notes
  • We offer a 30-day return/exchange service after receiving.
  • Final sale items are not eligible for returns or exchanges.
  • To process your return/exchange, please contact us at [email protected]
  • Please click here for more details>>> Return & Exchange Policy

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