WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscopes Intelligent automatic temperature controller and

Intelligent automatic temperature controller and other components

followed by a load

compatible for Macbook Pro A1707 (2016-2017) applicable for 0

4A and MTK-PE (5V/7V/9V/12V) Qualcomm quick charge protocol voltage Range of charge-through measurement

WDS-700 BGA desoldering Rework Station for circuit boards repair Oscilloscopes Intelligent automatic temperature controller andOptical alignment system BGA rework station WDS 700. WDS 700 BGA Rework Station are widely used to replace and repair the BGA chip in laptop, mobile phone, The main user is repairing shops and factory to provide the after sales service and rework. How to separate BGA chip from motherboard How to replace a new BGA chip Repair steps : Separate the BGA chip from mother board we called desoldering Clean Pad Reballing or replace a new BGA chip directly