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1X iPhone XR Front/Back grinding mold
Note: Arround 100°C is a suitable temperature to separate the LCD
Built-in set of parameters stored
heat up fast
Mijing KC8 Quicky Glue Removal Blade Set CPU Disassemble Knife Size:No.11+23 Set 1X iPhone XR Front/Back grindingMijing KC8 multi function Quick Release Knife for Mobile Phone Motherboard Glue Removal. MIJING KC8 Maintenance Knife Handle Blade Set IC Remove Glue Rework Blade CPU Disassemble Knife,Supports quick replacement blades. Qianli MEGA IDEA BXL01 Blade DIY Maintenance Knife for Phone Motherboard IC Chip Pry Glue Cuting RemovalFeatures: Press the rebound structure, quickly remove the blade. Multi functional glue removal knife, high temperature resistance,
